Thermal Engineer
Advantest Test Solutions, Inc. (ATS) is a global leader in massively parallel electronic test systems, supporting advanced semiconductor, module, SLT, and burn-in testing. We are seeking a Thermal Engineer to join our engineering team in Lake Forest, CA. This role offers the opportunity to work at the intersection of mechanical design, thermal system development, and hands-on testing in support of leading-edge semiconductor technologies.
Key Responsibilities:
Thermal and Mechanical Design
· Design thermal components including heaters, heatsinks, device interfaces, and cooling systems (e.g., cold plates, manifolds)
· Perform mechanical and thermal analysis of complex thermo-mechanical systems
· Conduct design reviews and validation for new and modified designs
Testing and Prototyping
· Execute and streamline testing procedures for thermal systems
· Interpret functional test results, document test setups and data, and present findings to internal and external stakeholders
· Develop and evaluate engineering prototypes
Field and Cross-Functional Support
· Provide hands-on support during product installation and commissioning
· Collaborate with field service teams to troubleshoot issues and guide corrective actions
· Recommend improvements to methods, tools, and processes
· All other duties as assigned.
Required Qualifications
- Bachelor’s degree in Mechanical Engineering, Thermal Engineering, or Physics (Master’s preferred)
- 3+ years of relevant experience in a high-tech environment
- Hands-on experience in thermal system testing or design engineering
- Solid understanding of conduction and convection-based thermal systems
- Strong analytical and problem-solving skills
- Willingness to travel (~10%) for customer support
- Must be able to work on-site in Lake Forest, CA
Preferred Qualifications
- Experience with electronic packaging, thermal integration, and automation systems
- Knowledge of Peltier devices, heatsinks, cryogenics, chiller, and two-phase cooling
- Experience with condensation abatement and airflow management
- Proficiency with 3D CAD tools, especially SolidWorks
- Exposure to thermal simulation tools (e.g., SolidWorks Flow Simulation, Ansys Icepak)
- Background in semiconductor capital equipment design and deployment
- Familiarity with burn-in ovens and active thermal control systems for automotive/military-grade devices
Pay: $100,000.00 - $180,000.00 per year
Location:
- Lake Forest, CA 92630 (Preferred)
Work Location: In person
